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Can meet the needs of different perspectives in the security field
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This series products with high power 35mil IR chips can realize high heat conductivity to ensure large current operation by using high power ceremic packaging technology. At the same time , this product has special optic design and full ranges of emission angles (30°,50°,60°,80°,90°,120°,160°)to meet different angle demand of Infrared security market.
High thermal conductive ceremic substrate
Large drive current
Unique optical design
Better heat dissipation and lower thermal resistance
High-power ceramics package, multi-angle optical design
Size: 3.5mmx3.5mm
Solder method: SMT
Electro Characteristics:( T solder pad =25℃ ) | |||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) | LED highly | |
Typ. | Max. | ||||||
ID8530 | 850 / 940 | 500~700 | 1.6 | 2.2 | 30° | 700 | 3.40mm |
ID8550 | 850 / 940 | 500~700 | 1.6 | 2.2 | 50° | 700 | 3.15mm |
ID8560 | 850 / 940 | 500~700 | 1.6 | 2.2 | 60° | 700 | 2.70mm |
ID8580 | 850 / 940 | 500~700 | 1.6 | 2.2 | 80° | 700 | 2.55mm |
ID8590 | 850 / 940 | 500~700 | 1.6 | 2.2 | 90° | 700 | 2.35mm |
ID85120 | 850 / 940 | 500~700 | 1.6 | 2.2 | 120° | 700 | 2.00mm |
ID85160 | 850 / 940 | 500~700 | 1.6 | 2.2 | 160° | 700 | 1.50mm |
Security monitoring
Mobile phone face recognition
Household robot
DMS on-board driver monitoring
Sensing,Drones
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