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CSP LEDs screen

CSP1414 3W

The bonding pad with a special structure has a low thermal resistance of 0.8℃/W, which effectively addresses the thermal stress between the chip and substrate resulted from inconsistent coefficient of thermal expansion and substantially reduces risks of electric leakage and dead light if the chip is pulled and cracked during operation. Non-bracket package, the light emitted from a single side is close to the Lambert pattern, convenient for secondary optical design. It is particularly useful for the flashlights and backlights.

Product advantages

Single-side emitting, benefit for secondary optical design

The special dual-layer film technique brings uniform distribution of color

Product features

Chip scale package,High brightness,High efficiency 

Size: 1.4mmx1.4mmx0.28mm,1-sided emitter

According to the ANSI standard colour gamut

Compatible with SMT

Viewing Angle: 120°

Package: Max 6000pcs/reel


Product Showcase

Electro Characteristics: (T solder pad =25℃,IF=1000mA)

 Normal CCT

Typ.Ra

Flux Rank / Luminous Flux (lm)

M2

N2

P2

280~300

300~320

320-340

4200-4800K

80


Applications

Indoor and outdoor lighting 

Flashlight of mobile phones   

Automotive lighting

Reference

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