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Flip Chip LED screen

TF1 4W/3535

TF1 employs ceremic plate to achieve high coefficient of thermal conductivity,and special eutectic process gives lower thermal resistence and better heat performance, Weld pad with hermoelectric separation design makes it can be driven by huge current;and special optical lens gives lambert curve emission that is easy for secondary light distribution.

Product features

Ceramic substrate package,High brightness,High efficiency

Size: 3.5mmx3.5mmx2.33mm

According to the ANSI standard colour gamut

Compatible with SMT

Viewing Angle: 120°

Package: Max 1000pcs/reel


Product Showcase

Electro Characteristics (T solder pad =25 ℃,IF=350mA) 
Normal CCT/KTyp.RaFlux   Rank / min Flux (lm)
S3S4S5S6
156164172182
300070

400070

500070

600070


Applications

Street lighting   

Tunnel lighting  

Industrial and mining lighting

Reference

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