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Flip Chip LEDs screen

TF1 4W

TF1 employs ceremic plate to achieve high coefficient of thermal conductivity,and special eutectic process gives lower thermal resistence and better heat performance, Weld pad with hermoelectric separation design makes it can be driven by huge current;and special optical lens gives lambert curve emission that is easy for secondary light distribution.

Product features

Ceramic substrate package,High brightness,High efficiency

Size: 3.5mmx3.5mmx2.24mm

According to the ANSI standard colour gamut

Compatible with SMT

Viewing Angle: 120°

Package: Max 1000pcs/reel


Product Showcase

Electro Characteristics : ( T solder pad =25℃,IF=350mA )

Normal CCT

Typ.Ra

Flux Rank / min Flux (lm)

R4

R5

S2

S3

S4

S5

S6

130

139

148

156

164

172

182

2600~2900K

80





2900~3250K

80



3250~3750K

70/80



3750~4250K

70



5300~7000K

70



Applications

Street lighting   

Tunnel lighting  

Industrial and mining lighting

Reference

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