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Provide high reliability VCSEL product series solutions
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Adopting high-end multi junction chip technology and existing ultra high power chip packaging technology from Jingneng, we can customize VCSEL series products with different structural shapes, bands, power, FOV, etc. for customers. Applied in the market of facial recognition, AR/VR, intelligent assisted driving, floor sweepers, drones and other applications, 3D images are brought closer to various aspects of life and provide a more accurate, intelligent, and secure era for this.
High light efficiency, high response rate
Good light source consistency
FOV: 60 ° x45 °/68 ° x54 °/72 ° x58 °/90 ° x70 ° (customizable)
Ceramic packaging, high light efficiency, high response rate, and good light source consistency
Size: 2.8mmx3.3mmx1.23mm
Center wavelength: 850nm or 940nm
FOV: 60 ° x45 °/68 ° x54 °/72 ° x58 °/90 ° x70 ° (customizable)
Support for surface mount technology (SMT)
Packaging: Up to 1000 rolls
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