LP-UVM5632150A1 UVA curing module uses high-power UVA LED chip with vertical structure as light source ,and has flexible substrate circuit design and high reliability of weld wire. This module can achieve high density UV light output in small luminous area through high density arrangement and the size and power of the product can be customized according to customer requirements.
Ceramic plate with good thermal conductivity
Vertical chips make energy density concentration
Special chip weld wire design improves reliability
Electro Characteristics：(T solder pad =25 ℃)
Emitting Area Size
Forward Voltage (V)