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GaN-on-Si LED Chips


LatticePower's  high-power LED chip based on technology which won the first prize of 2015 National Technical Innovation award. This chip features uniform distribution of current, single-side light emitting, high quality light, perfect for mobile lighting such as automotive light, searchlight and miner lamp, as well as flashlight of mobile phones and other lighting applications that require uniform and precision color.  


ProductSize/milCurrent/mAOutput Power/mWVoltage/VMain  Wavelength/nm
LPTBG18A18x18150~200210~285@150mA2.8-3.4@150mA445-465@150mA
LPTBG24A24x24350~500510~680@350mA2.9-3.4@350mA445-465@350mA
LPTBG26G26x26350~500525~680@350mA2.9-3.4@350mA445-465@350mA
LPTBG27C27x27350~500500~680@350mA2.9-3.4@350mA445-465@350mA
LPTBG30D30x30350~500540~680@350mA2.8-3.3@350mA445-465@350mA
LPTBG32E32x32350~500540~680@350mA2.8-3.3@350mA445-465@350mA
LPTBG35B35x35350~700550~760@350mA2.7-3.3@350mA445-465@350mA
LPTBG36C36x36350~700570~760@350mA2.7-3.3@350mA445-465@350mA
LPIBG36A36x36350~500400~640@350mA2.6-3.4@350mA445-465@350mA
LPTBG42C42x42350~1000570~800@350mA2.7-3.3@350mA445-465@350mA
LPTBG45D45x45350~1000540~760@350mA2.7-3.2@350mA445-465@350mA
LPTBG56E56x56350~1500600~860@350mA2.6-3.1@350mA445-465@350mA
LPTBG55D55x55C350~3500600~800@350mA2.8-3.1@1A445-465@1A
LPIBG63C63x63350~1500510~680@350mA2.6-3.1@350mA445-465@350mA
LPTBG63D63x63C350~4500600~860@350mA2.7-3.2@1A445-465@1A
LPTBG73F73x73350~2000600~860@350mA2.7-3.0@1A445-465@1A
LPTBG81F81x81350~2000600~860@350mA2.7-3.0@1A445-465@1A
LPTBG80F80x80C1000~7000570~760@350mA2.7-3.1@1A445-465@1A
LPTBGC0E120x120C1000~10000600~800@350mA2.6-3.0@1A445-465@1A


Applications

Portable lighting

Mobile flash

Automotive lighting

Special purpose lighting

Indoor and outdoor lighting

Features and benefits

● Reflecting Silver contact provide uniform current distribition and allow for high drive current
● The silicon substrate has better heat dissipation than sapphire substrate
● Lambert luminous pattern with uniform white
● Less wire bonding, high reliability 
● Works with conductive silver adhesive, soldering tin or eutectic bonded LED die 

● The vertical LED chip works with direct phosphor coating for cost reduction and higher quality light

● Suitable for high power ceramic package

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