It uses ceremic packaging technology benefits for good cooling performance and high reliability,and it also uses patented GaN-on-Si LED chips with vertical structure which helps directional light emission.At the same time,its thermoelectric separation design and 120° of light angle enables more flexible applications.
It utilizes ceremic packaging to achieve high thermal conductivity and optimum circuit design to realize larger cooling area for customers;it uses special welding process to give customers lower thermal resistence and higher reliability. It's light angle is 120°, after finished product assembly, customers can get high high center angle, high brightness and easy optical design.
Ceramic substrate package,High brightness,High efficiency
Compatible with SMT
Viewing Angle: 120°
Package: Max 1000pcs/reel
Electro Characteristics : (T solder pad =25℃，IF=350mA)