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It uses ceremic packaging technology benefits for good cooling performance and high reliability,and it also uses patented GaN-on-Si LED chips with vertical structure which helps directional light emission.At the same time,its thermoelectric separation design and 120° of light angle enables more flexible applications.
It utilizes ceremic packaging to achieve high thermal conductivity and optimum circuit design to realize larger cooling area for customers;it uses special welding process to give customers lower thermal resistence and higher reliability. It's light angle is 120°, after finished product assembly, customers can get high high center angle, high brightness and easy optical design.
Ceramic substrate package,High brightness,High efficiency
Size: 3.5mmx3.5mmx2.24mm
Compatible with SMT
Viewing Angle: 120°
Package: Max 1000pcs/reel
Electro Characteristics (T solder pad =25℃,IF=350mA) | |||||||
Item | Wave length | Flux (lm) | |||||
Min. | Typ. | Max. | |||||
Red | 620-630nm | 67 | 75 | 87 | |||
Green | 495-505nm | 100 | 110 | 130 | |||
Green | 520-530nm | 130 | 135 | 150 | |||
Amber | 585-600nm | 60 | 75 | 85 | |||
Item | Wave length | Radiant Power(mw) | |||||
Min. | Typ. | Max. | |||||
Far Red | 720-740nm | 360 | 430 | 500 | |||
Blue | 450-460nm | 545 | 700 | 770 |
Stage lighting
Horticulture
Landscape lighting
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