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Learn how UV applications can be implemented to provide new light sources for industrial curing, sterilization/disinfection, etc.
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LP-UVM5632150A1 150W Product introduction

LP-UVM5632150A1 UVA curing module uses high-power UVA LED chip with vertical structure as light source ,and has flexible substrate circuit design and high reliability of weld wire. This module can achieve high density UV light output in small luminous area through high density arrangement and the size and power of the product can be customized according to customer requirements.


Product features

Ceramic plate with good thermal conductivity

Vertical chips make energy density concentration

Special chip weld wire design improves reliability


Product Showcase

Electro Characteristics:(T solder pad =25 ℃)

Emitting Area Size

(mm)

WLP

(nm)

Radiation Intensity

(mW)

Forward Voltage (V)

Power (W)

Typ.@2800mA

32.8*32.6

390~395

≥80000

56

150


applications

Industrial curing

UV exposure

Printing

Plate printing


Reference

LP-UVM4029150A1 150W Product introduction

LP-UVM4029150A1 UVA curing module uses high-power UVA LED chip with vertical structure as light source ,and has flexible substrate circuit design and high reliability of weld wire. This module can achieve high density UV light output in small luminous area through high density arrangement and the size and power of the product can be customized according to customer requirements.


Product features

Ceramic plate with good thermal conductivity

Vertical chips make energy density concentration

Special chip weld wire design improves reliability


Product Showcase

Electro Characteristics:(T solder pad =25 ℃)

Emitting Area Size(mm)

WLP (nm)

Radiation Intensity(W/cm2)

Forward Voltage (V)

Power (W)

Typ.@4200mA

28.77*8.3

390~395

≥20

42

150


applications

Industrial curing

UV exposure

Printing

Plate printing


Reference

LP-UVM5535180A1 180W Product introduction

LP-UVM5535180A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV light output in small luminous area and the size and power of the product can be customized according to customer requirements.


Product features

Ceramic plate with high thermal conductivity

Vertical chips with high center energy density

Special chip wire bond design improves reliability


Product Showcase

Electro Characteristics: (T solder pad =25 ℃)

Emitting Area Size

(mm)

WLP

(nm)

Radiation Intensity

(W/cm2)

Forward Voltage (V)

Power (W)

Typ.@1500mA

33.96*28.3

390~395

≥15

140

180


applications

Industrial curing

UV exposure

Printing

Plate printing


Reference

LP-UVM6025150A1 150W Product introduction

LP-UVM6025150A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV  light output in small luminous area and the size and power of the product can be customized according to customer requirements.


Product features

Ceramic plate with good thermal conductivity

Vertical chips with high center energy density

Special chip wire bond design improves reliability


Product Showcase

Electro Characteristics: (T solder pad =25 ℃)   

Emitting Area Size

(mm)

WLP (nm)

Radiation Intensity(W/cm2)

Forward Voltage (V)

Power (W)

Typ.@1800mA*3

27.6*25

390~395

≥15

28

150


applications

Industrial curing

UV exposure

Printing

Plate printing


Reference