UVA Curing Modules
GaN-On-Si high-power ultraviolet chip with unique chip soldering design
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Learn how UV applications can be implemented to provide new light sources for industrial curing, sterilization/disinfection, etc.
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LP-UVM5632150A1 150W Product introduction
LP-UVM5632150A1 UVA curing module uses high-power UVA LED chip with vertical structure as light source ,and has flexible substrate circuit design and high reliability of weld wire. This module can achieve high density UV light output in small luminous area through high density arrangement and the size and power of the product can be customized according to customer requirements.
Product features
Ceramic plate with good thermal conductivity
Vertical chips make energy density concentration
Special chip weld wire design improves reliability
Product Showcase
Electro Characteristics：(T solder pad =25 ℃) |
Emitting Area Size (mm) | WLP (nm) | Radiation Intensity (mW) | Forward Voltage (V) | Power (W) |
Typ.@2800mA |
32.8*32.6 | 390~395 | ≥80000 | 56 | 150 |
applications
Industrial curing
UV exposure
Printing
Plate printing
Reference
LP-UVM4029150A1 150W Product introduction
LP-UVM4029150A1 UVA curing module uses high-power UVA LED chip with vertical structure as light source ,and has flexible substrate circuit design and high reliability of weld wire. This module can achieve high density UV light output in small luminous area through high density arrangement and the size and power of the product can be customized according to customer requirements.
Product features
Ceramic plate with good thermal conductivity
Vertical chips make energy density concentration
Special chip weld wire design improves reliability
Product Showcase
Electro Characteristics：(T solder pad =25 ℃) |
Emitting Area Size(mm) | WLP (nm) | Radiation Intensity(W/cm2) | Forward Voltage (V) | Power (W) |
Typ.@4200mA |
28.77*8.3 | 390~395 | ≥20 | 42 | 150 |
applications
Industrial curing
UV exposure
Printing
Plate printing
Reference
LP-UVM5535180A1 180W Product introduction
LP-UVM5535180A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV light output in small luminous area and the size and power of the product can be customized according to customer requirements.
Product features
Ceramic plate with high thermal conductivity
Vertical chips with high center energy density
Special chip wire bond design improves reliability
Product Showcase
Electro Characteristics： (T solder pad =25 ℃) |
Emitting Area Size (mm) | WLP (nm) | Radiation Intensity (W/cm2)
| Forward Voltage (V) | Power (W) |
Typ.@1500mA |
33.96*28.3 | 390~395 | ≥15 | 140 | 180 |
applications
Industrial curing
UV exposure
Printing
Plate printing
Reference
LP-UVM6025150A1 150W Product introduction
LP-UVM6025150A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV light output in small luminous area and the size and power of the product can be customized according to customer requirements.
Product features
Ceramic plate with good thermal conductivity
Vertical chips with high center energy density
Special chip wire bond design improves reliability
Product Showcase
Electro Characteristics： (T solder pad =25 ℃) |
Emitting Area Size (mm) | WLP (nm) | Radiation Intensity(W/cm2) | Forward Voltage (V) | Power (W) |
Typ.@1800mA*3 |
27.6*25 | 390~395 | ≥15 | 28 | 150 |
applications
Industrial curing
UV exposure
Printing
Plate printing
Reference
