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The LED uses our glass lens + high-power 3D ceramic packaging technology + UVC LED chip, with UVC wavelength range of 270-280nm.
3535 ceramic packaging is compatible with many different type of standard PCB board
UVC LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
High-power 3D-ceramics package, Glass LENS
UVC ultraviolet radiation , Korean UVC LED chip
Size: 3.5mmx3.5mmx1.6mm
Zener protection
Solder method: SMT
Electro Characteristics: (T solder pad =25℃,IF=40mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) | |
Typ. | Max. | |||||
UB275-35F (Glass LENS) | 270-280 | 7-15 | 5.0 | 8.0 | 120° | 100 |
UVC surface sterilization
Portable sterilization scheme
Biochemical analysis
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 390~400nm.
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
High-power ceramics package, High radiant energy
Si-UV LED chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics:(T solder pad =25℃,IF=350mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2(degree) | Current (mA) | |
Typ. | Max. | |||||
UXDO-Y | 395 (390-400) | 400-700 | 3.3 | 3.8 | 120° | 350 |
370 (365-375) | 300-500 | 3.6 | 4 | 120° | 350 |
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 410~425nm.
3535 ceramic packaging is compatible with many different type ofstandard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emissiondesign with 120° light angle
Excellent reliability, highperformance at low cost
High-power ceramics package, High radiant energy
46mil Si-UV LED Chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics : (T solder pad =25 ℃,IF=500mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) | |
Typ. | Max. | |||||
UXFO-D | 415 (410-425) | 800-1000 | 3.2 | 3.6 | 120° | 500 |
UXFO-Y | 370 (365-375) | 500-800 | 3.7 | 4 | 120° | 500 |
Fish attracting
Bacteriostatic
Horticulture
Fluorescer detection
Gem identification
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
High-power ceramics package, high radiant energy
Si-UV LED chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics: (T solder pad =25 ℃,IF=500mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) | |
Typ. | Max. | |||||
UXEO-G | 405 (400-405) | 800-1100 | 3.45 | 3.8 | 120° | 500 |
395 (390-400) | 800-1100 | 3.45 | 3.8 | 120° | 500 | |
385 (380-390) | 800-1100 | 3.45 | 3.8 | 120° | 500 | |
370 (365-375) | 600-900 | 3.6 | 4 | 120° | 500 |
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 55° light angle
Excellent reliability,high performance at low cost
High-power ceramics package, high radiant energy
Si-UV LED chip
Size: 3.5x3.5mmx3.1mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics :(T solder pad =25 ℃,IF=500mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2(degree) | Current (mA) | |
Typ. | Max. | |||||
UXSO-G | 405 (400-405) | 800-1100 | 3.45 | 3.8 | 55° | 500 |
395 (390-400) | 800-1100 | 3.45 | 3.8 | 55° | 500 | |
385 (380-390) | 800-1100 | 3.45 | 3.8 | 55° | 500 | |
370 (365-375) | 600-900 | 3.6 | 4 | 55° | 500 |
The LED uses our GaN-on-Si UVA chips and 3838 high-power ceramic packaging process, with wavelength range of 380-390nm & 390-400nm.
3838 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 50° light angle
Excellent reliability, high performance at low cost
High-power 3D-ceramics package,glass LENS,high radiant energy
Si-UVLED chip
Size: 3.85mmx3.85mmx3.31mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics: (T solder pad =25 ℃,IF=650mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage(V) | Directivity 2θ1/2(degree) | Current (mA) | |
Typ. | Max. | |||||
UXGO-G6E (Glass Lens) | 395 (390-400) | 1000-1300 | 3.5 | 3.8 | 50° | 650 |
385 (380-390) | 1000-1300 | 3.5 | 3.8 | 50° | 650 |
The LED uses our GaN-on-Si UVA chips and 7070 high-power ceramic packaging process,with wavelength range of 385nm/395nm.
7070 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 68° light angle
Excellent reliability, high performance at low cost
High-power 3D-ceramics package, Glass LENS
High Radiant Energy, Si-UV LED Chip
Size: 7.0mmx7.0mmx4.77mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics : (T solder pad =25 ℃,IF=1500mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Electric current (mA) | |
Typ. | Max. | |||||
UXNO-G (Glass Lens) | 395 (390-400) | 4000-5000 | 6.8 | 7.5 | 68° | 1500 |
385 (380-390) | 4000-5000 | 6.8 | 7.5 | 68° | 1500 |
This LED uses small and medium power EMC packaging technology and silicon based & sapphire UV LED chips,with wavelength range of 365-375nm.
3030 EMC packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90° light angle
Excellent reliability, high performance at low cost
EMC package, High radiant energy, Wide spectrum, Si-UV LED chip
Size: 3.0mmx3.0mmx1.82mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics (T solder pad =25℃,IF=150mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Electric current (mA) | |
Typ. | Max. | |||||
EU-A | 370 (365-375nm) | 100-300 | 3.4 | 4 | 90° | 150 |
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
The LED uses small and medium power EMC packaging technology + silicon-based & sapphire UV LED chips, The main supply of UVA waveband is: 365-375nm + 395-405nm mixed wave wavelength (double wave peak product).
3030 EMC packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90-100° light angle
Excellent reliability, high performance at low cost
EMC package, High radiant Energy, Wide spectrum
20mil Si-UV LED chip & 17*19mi sapphire chip
Size: 3.0mmx3.0mmx1.82mm
Solder method: SMT
Electro Characteristics (T solder pad =25 ℃,IF=90mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2(degree) | Electric current (mA) | |
Typ. | Max. | |||||
EM30-NA | 365-405 (Multi peak mixed wave) | 100-300 | 6.8 | 7.5 | 90-100° | 90 |
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
This UVC module for air sterilization uses 270-280nm UVC chip imported from South Korea and uses special aluminum substrate plus high-precision packaging to realize low thermal resistance, strong heat dissipation and high reliability. At the same time, it achieves high-density UV light output in a small luminous area and sterilization rate up to 99.99% to meet the requirements of sterilization and other applications.
The LED is made of UVC chip 270-280nm, with high sterilization efficiency, up to 99.99%
Imported chip from South Korea with high reliability
Low thermal resistance and strong heat dissipation ability of PCB customized aluminum plate
Size : 110*12*1 mm (Customizable)
Special Al substrate with high precision packaging combined to reach high stability
Electro Characteristics: (T solder pad =25 ℃) | ||||
Peak Wavelength (nm) | Radiation Power (mW) | Viewing Angle | Forward Voltage (V) | Power (W) |
Typ.@40mA | ||||
270~280 | 6-15 | 120° | 15-24 | 0.84 |