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易于使用的集成“即插即用”配置用于前照灯系统
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Learn how UV applications can be implemented to provide new light sources for industrial curing, sterilization/disinfection, etc.
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UA275-35F 0.3W/3535 Product introduction
The LED uses our glass lens + high-power 3D ceramic packaging technology + UVC LED chip, with UVC wavelength range of 270-280nm.
UA275-35F 0.3W/3535 Product advantages
3535 ceramic packaging is compatible with many different type of standard PCB board
UVC LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
Product features
High-power 3D-ceramics package, Glass LENS
UVC ultraviolet radiation , Korean UVC LED chip
Size: 3.5mmx3.5mmx1.6mm
Zener protection
Solder method: SMT
Product Showcase
Electro Characteristics： (T solder pad =25℃，IF=40mA) |
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) |
Typ. | Max. |
UA275-35F （Glass LENS） | 270-280 | 2-5 | 6.8 | 8.0 | 120° | 40 |
applications
UVC surface sterilization
Portable sterilization scheme
Biochemical analysis
Reference
VD 2W/3535 Product introduction
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 390~400nm.
VD 2W/3535 Product advantages
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
Product features
High-power ceramics package, High radiant energy
Si-UV LED chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
| Electro Characteristics (T solder pad =25 �C) |
| Product | Peak Wavelength (nm) | Total Rad Flux (mW) | Voltage(V) | Directivity 2θ1/2 (degree) | Electric current (mA) |
| Typ. | Max. |
VD
(VDC6W) | 395 (390-400nm) | 500-800 | 3.3 | 3.8 | 120° | 350 |
369 (365-375nm) | 400-700 | 3.5 | 4.0 | 120° | 350 |
applications
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
Reference
VF 3W/3535 Product introduction
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 410~425nm.
VF 3W/3535 Product advantages
3535 ceramic packaging is compatible with many different type ofstandard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emissiondesign with 120° light angle
Excellent reliability, highperformance at low cost
Product features
High-power ceramics package, High radiant energy
46mil Si-UV LED Chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
| Electro Characteristics (T solder pad =25 �C) |
| Product | Peak Wavelength (nm) | Total Rad Flux (mW) | Voltage(V) | Directivity 2θ1/2 (degree) | Electric current (mA) |
| Typ. | Max. |
| VF-D | 415 (410-425nm) | 800-1000 | 3.2 | 3.6 | 120° | 500 |
| VF-Y | 369 (365-375nm) | 500-800 | 3.6 | 4.0 | 120° | 500 |
applications
Fish attracting
Bacteriostatic
Horticulture
Fluorescer detection
Gem identification
Reference
VE 3W/3535 Product introduction
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.
VE 3W/3535 Product advantages
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
Product features
High-power ceramics package, high radiant energy
Si-UV LED chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
Electro Characteristics： (T solder pad =25 ℃，IF=500mA) |
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) |
Typ. | Max. |
VE-G | 405 (400-405) | 800-1100 | 3.45 | 3.8 | 120° | 500 |
395 (390-400) | 800-1100 | 3.45 | 3.8 | 120° | 500 |
385 (380-390) | 800-1100 | 3.45 | 3.8 | 120° | 500 |
370 (365-375) | 700-1000 | 3.6 | 4 | 120° | 500 |
applications
Industrial curing
Acteriostatic
Exposure
Reference
VS 3W/3535 Product introduction
The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.
VS 3W/3535 Product advantages
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 55° light angle
Excellent reliability,high performance at low cost
Product features
High-power ceramics package, high radiant energy
Si-UV LED chip
Size: 3.5x3.5mmx3.1mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
Electro Characteristics ：(T solder pad =25 ℃，IF=500mA) |
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2(degree) | Current (mA) |
Typ. | Max. |
VS-G | 405 (400-405) | 800-1100 | 3.45 | 3.8 | 55° | 500 |
395 (390-400) | 800-1100 | 3.45 | 3.8 | 55° | 500 |
385 (380-390) | 800-1100 | 3.45 | 3.8 | 55° | 500 |
370 (365-375) | 700-1000 | 3.6 | 4 | 55° | 500 |
applications
Industrial curing
Bacteriostasis
Exposure
Reference
VG 3W/3838 Product introduction
The LED uses our GaN-on-Si UVA chips and 3838 high-power ceramic packaging process, with wavelength range of 380-390nm & 390-400nm.
VG 3W/3838 Product advantages
3838 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 50° light angle
Excellent reliability, high performance at low cost
Product features
High-power 3D-ceramics package,glass LENS,high radiant energy
Si-UVLED chip
Size: 3.85mmx3.85mmx3.31mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
Electro Characteristics： (T solder pad =25 ℃，IF=650mA) |
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage(V) | Directivity 2θ1/2(degree) | Current (mA) |
Typ. | Max. |
VG-G6E （Glass Lens） | 395 (390-400) | 1000-1300 | 3.5 | 3.8 | 50° | 650 |
385 (380-390) | 1000-1300 | 3.5 | 3.8 | 50° | 650 |
VN 15W/6868 Product introduction
The LED uses our GaN-on-Si UVA chips and 7070 high-power ceramic packaging process,with wavelength range of 385nm/395nm.
VN 15W/6868 Product advantages
7070 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 68° light angle
Excellent reliability, high performance at low cost
Product features
High-power 3D-ceramics package, Glass LENS
High Radiant Energy, Si-UV LED Chip
Size: 7.0mmx7.0mmx4.77mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
| Electro Characteristics : (T solder pad =25 ℃，IF=1500mA) |
| Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Electric current (mA) |
| Typ. | Max. |
VN-G （Glass Lens） | 395 (390-400) | 4000-5000 | 6.8 | 7.5 | 68° | 1500 |
385 (380-390) | 4000-5000 | 6.8 | 7.5 | 68° | 1500 |
EU 0.5W/3030 Product introduction
This LED uses small and medium power EMC packaging technology and silicon based & sapphire UV LED chips,with wavelength range of 365-375nm.
EU 0.5W/3030 Product advantages
3030 EMC packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90° light angle
Excellent reliability, high performance at low cost
Product features
EMC package, High radiant energy, Wide spectrum, Si-UV LED chip
Size: 3.0mmx3.0mmx1.82mm
8KV electrostatic protection
Solder method: SMT
Product Showcase
| Electro Characteristics (T solder pad =25℃，IF=150mA) |
| Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Electric current (mA) |
| Typ. | Max. |
| EU-A | 370 (365-375nm) | 100-300 | 3.4 | 4 | 90° | 150 |
applications
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
Reference
EM 1W/3030 Product introduction
The LED uses small and medium power EMC packaging technology + silicon-based & sapphire UV LED chips, The main supply of UVA waveband is: 365-375nm + 395-405nm mixed wave wavelength (double wave peak product).
EM 1W/3030 Product advantages
3030 EMC packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90-100° light angle
Excellent reliability, high performance at low cost
Product features
EMC package, High radiant Energy, Wide spectrum
20mil Si-UV LED chip & 17*19mi sapphire chip
Size: 3.0mmx3.0mmx1.82mm
Solder method: SMT
Product Showcase
| Electro Characteristics (T solder pad =25 ℃，IF=90mA) |
| Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2(degree) | Electric current (mA) |
| Typ. | Max. |
| EM30-NA | 365-405 (Multi peak mixed wave) | 100-300 | 6.8 | 7.5 | 90-100° | 90 |
applications
Purple color
Plant lighting
Fluoresce detection
Photocatalyst
Reference
UB275-35F 0.3W/3535 Product introduction
The LED uses our glass lens + high-power 3D ceramic packaging technology + UVC LED chip, with UVC wavelength range of 270-280nm.
UB275-35F 0.3W/3535 Product advantages
3535 ceramic packaging is compatible with many different type of standard PCB board
UVC LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
Product features
High-power 3D-ceramics package, Glass LENS
UVC ultraviolet radiation , Korean UVC LED chip
Size: 3.5mmx3.5mmx1.6mm
Zener protection
Solder method: SMT
Product Showcase
Electro Characteristics： (T solder pad =25℃，IF=40mA) |
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) |
Typ. | Max. |
UB275-35F （Glass LENS） | 270-280 | 7-15 | 5.0 | 8.0 | 120° | 100 |
applications
UVC surface sterilization
Portable sterilization scheme
Biochemical analysis
Reference
