LP-CSI3838100B1 commercial lighting modules use CSP array on a high thermal conductive Al substrate to realize low thermal resistance and high current performance. It can emit high flux over a small light emission area by high density chips arrangement, and its customized size and power enable customers to have more choices in different applications, such as street lighting and industrial lighting.
High CRI CSP,Al substrate
High heat dissipation
High luminous efficiency and high flux
Electro Characteristics： (T solder pad =25 ℃)
Luminous Flux (lm)
Luminous Efficiecy (ђ)
Forward Voltage (V)