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Learn how UV applications can be implemented to provide new light sources for industrial curing, sterilization/disinfection, etc.
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UXDO 2W Product introduction

The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 390~400nm.


UXDO 2W Product advantages

3535 ceramic packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost


Product features

High-power ceramics package, High radiant energy

Si-UV LED chip

Size: 3.5mmx3.5mmx2.3mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics:(T solder pad =25℃,IF=350mA)

Product

Peakwavelength (nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2(degree)

Current

(mA)

Typ.

Max.

UXDO-Y

395

(390-400)

400-700

3.3

3.8

120°

350

370

(365-375)

300-500

3.6

4

120°

350


applications

Purple color

Plant lighting

Fluoresce detection

Photocatalyst

Reference

UXFO 3W Product introduction

The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 365~375nm and 410~425nm.


UXFO 3W Product advantages

3535 ceramic packaging is compatible with many different type ofstandard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emissiondesign with 120° light angle
Excellent reliability, highperformance at low cost


Product features

High-power ceramics package, High radiant energy

46mil Si-UV LED Chip

Size: 3.5mmx3.5mmx2.3mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics : (T solder pad =25 ℃,IF=500mA)

Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2 (degree)

Current

(mA)

Typ.

Max.

UXFO-D

415

(410-425)

800-1000

3.2

3.6

120°

500

UXFO-Y

370

(365-375)

500-800

3.7

4

120°

500


applications

Fish attracting

Bacteriostatic

Horticulture

Fluorescer detection

Gem identification

Reference

UXEO 3W Product introduction

The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.

UXEO 3W Product advantages

3535 ceramic packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost


Product features

High-power ceramics package, high radiant energy

Si-UV LED chip

Size: 3.5mmx3.5mmx2.3mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics: (T solder pad =25 ℃,IF=500mA)

Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2 (degree)

Current

(mA)

Typ.

Max.

UXEO-G

405

(400-405)

800-1100

3.45

3.8

120°

500

395

(390-400)

800-1100

3.45

3.8

120°

500

385

(380-390)

800-1100

3.45

3.8

120°

500

370

(365-375)

600-900

3.6

4

120°

500


applications

Industrial curing

Acteriostatic

Exposure


Reference

UXSO 3W Product introduction

The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.


UXSO 3W Product advantages

3535 ceramic packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 55° light angle
Excellent reliability,high performance at low cost

Product features

High-power ceramics package, high radiant energy

Si-UV LED chip

Size: 3.5x3.5mmx3.1mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics :(T solder pad =25 ℃,IF=500mA)

Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2(degree)

Current

(mA)

Typ.

Max.

UXSO-G

405

(400-405)

800-1100

3.45

3.8

55°

500

395

(390-400)

800-1100

3.45

3.8

55°

500

385

(380-390)

800-1100

3.45

3.8

55°

500

370

(365-375)

600-900

3.6

4

55°

500


applications

Industrial curing

Bacteriostasis

Exposure

Reference

UXGO 3W Product introduction

The LED uses our GaN-on-Si UVA chips and 3838 high-power ceramic packaging process, with wavelength range of 380-390nm & 390-400nm.

UXGO 3W Product advantages

3838 ceramic packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 50° light angle
Excellent reliability, high performance at low cost


Product features

High-power 3D-ceramics package,glass LENS,high radiant energy

Si-UVLED chip

Size: 3.85mmx3.85mmx3.31mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics: (T solder pad =25 ℃,IF=650mA)

Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage(V)

Directivity

2θ1/2(degree)

Current

(mA)

Typ.

Max.

UXGO-G6E

(Glass Lens)

395

(390-400)

1000-1300

3.5

3.8

50°

650

385

(380-390)

1000-1300

3.5

3.8

50°

650


applications

Industrial curing

Reference

UXNO 15W Product introduction

The LED uses our GaN-on-Si UVA chips and 7070 high-power ceramic packaging process,with wavelength range of 385nm/395nm.



UXNO 15W Product advantages

7070 ceramic packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 68° light angle
Excellent reliability, high performance at low cost


Product features

High-power 3D-ceramics package, Glass LENS

High Radiant Energy, Si-UV LED Chip

Size: 7.0mmx7.0mmx4.77mm

8KV electrostatic protection

Solder method: SMT

Product Showcase


Electro Characteristics : (T solder pad =25 ℃,IF=1500mA)
Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2 (degree)

Electric current

(mA)

Typ. Max.

UXNO-G

(Glass Lens)

395

(390-400)

4000-50006.87.568°1500

385

(380-390)

4000-50006.87.568°1500


applications

Exposure machine

Reference

EU 0.5W Product introduction

This LED uses small and medium power EMC packaging technology and silicon based & sapphire UV LED chips,with wavelength range of 365-375nm.


EU 0.5W Product advantages

3030 EMC packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90° light angle
Excellent reliability, high performance at low cost


Product features

EMC package, High radiant energy, Wide spectrum, Si-UV LED chip

Size: 3.0mmx3.0mmx1.82mm

8KV electrostatic protection

Solder method: SMT

Product Showcase

Electro Characteristics (T solder pad =25℃,IF=150mA)
Product

Peakwavelength

(nm)

Total Rad Flux

(mW)

Voltage (V)

Directivity

2θ1/2 (degree)

Electric current (mA)
Typ. Max.
EU-A

370

(365-375nm)

100-3003.4490°150



applications

Purple color

Plant lighting

Fluoresce detection

Photocatalyst

Reference

EM 1W Product introduction

The LED uses small and medium power EMC packaging technology + silicon-based & sapphire UV LED chips,  The main supply of UVA waveband is: 365-375nm + 395-405nm mixed wave wavelength (double wave peak product).

EM 1W Product advantages

3030 EMC packaging is compatible with many different type of standard PCB board

UVA LED has high irradiance and optical power output
Primary optical lens emission design with 90-100° light angle
Excellent reliability, high performance at low cost


Product features

EMC package, High radiant Energy, Wide spectrum

20mil Si-UV LED chip & 17*19mi sapphire chip

Size: 3.0mmx3.0mmx1.82mm

Solder method: SMT

Product Showcase

Electro   Characteristics (T solder pad =25 ℃,IF=90mA) 
Product

Peakwavelength

 (nm)

Total Rad Flux

 (mW)

Voltage (V)

Directivity

 2θ1/2(degree)

 Electric current 

(mA)

Typ. Max.   
EM30-NA

365-405

 (Multi peak mixed wave)

100-3006.87.590-100°90


applications

Purple color

Plant lighting 

Fluoresce detection

Photocatalyst

Reference