The chip scale package(CSP1111) uses a flipchip, TiO side-coating, integrated plated contact, single-side phosphor film to create the compact LED with single side top light emission. This product can be used in mobile phones camera flash, full-spectrum lighting with a color temperature between 3000K to 5000K.
Chip-scale package, low thermal resistance, high performance
Single-side emitting, benefit for secondary optical design
Small luminous surface and high optical density
Special phosphor film, uniform color over angle, and no low drift
Chip scale package,High brightness,High efficiency
Size: 1.05mmx1.05mmx0.28mm,1-sided emitter
According to the ANSI standard color gamut
Compatible with SMT
Viewing Angle: 120°
| Electro Characteristics (T solder pad =25 ℃，IF=250mA) | |||||
| Normal CCT/K | Flux Rank / Luminous Flux (lm) | ||||
| X2 | X3 | X4 | X5 | ||
| 90-100 | 100-110 | 110-120 | 120-130 | ||
| 5400-6500 | ● | ● | ● | ● | |
| Normal CCT/K | D1 | E1 | F1 | G1 | |
| 60-70 | 70-80 | 80-90 | 90-100 | ||
| 1600-1900 | ● | ● | ● | ● | |
Automotive lighting
Specification Sheet：
Optical File Link：
https://pan.baidu.com/s/1CQLZvUaU3lkPurR_YBNlgg?pwd=ytse
Code : ytse
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