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Provide highly reliable high-power visible light solutions
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It uses ceremic packaging technology benefits for good cooling performance and high reliability,and it also uses patented GaN-on-Si LED chips with vertical structure which helps directional light emission.At the same time,its thermoelectric separation design and 120° of light angle enables more flexible applications.
It utilizes ceremic packaging to achieve high thermal conductivity and optimum circuit design to realize larger cooling area for customers;it uses special welding process to give customers lower thermal resistence and higher reliability. It's light angle is 120°, after finished product assembly, customers can get high high center angle, high brightness and easy optical design.
Ceramic substrate package,High brightness,High efficiency
Size: 3.5mmx3.5mmx2.24mm
Compatible with SMT
Viewing Angle: 120°
Package: Max 1000pcs/reel
Electro Characteristics : (T solder pad =25℃,IF=350mA) | ||||
Item | WD/CCT | Flux (lm) | ||
Min. | Typ. | Max. | ||
Blue | 450-475nm | 400 mw | 550 mw | 650 mw |
Green | 495-550nm | 100 lm | 140 lm | 150 lm |
Amber | 580-600nm | 40 lm | 46 lm | 52 lm |
Red | 615-635nm | 50 lm | 70 lm | 90 lm |
Photo Red | 650-670nm | 300 mw | 350 mw | 400 mw |
Far Red | 720-740nm | 250 mw | 300 mw | 400 mw |
Stage lighting
Horticulture
Landscape lighting
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