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UVA Industrial Curing Modules screen

LP-UVM5535180A1 180W

LP-UVM5535180A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV  light output in small luminous area and the size and power of the product can be customized according to customer requirements.


Product features

Ceramic plate with high thermal conductivity

Vertical chips with high center energy density

Special chip wire bond design improves reliability


Product Showcase

Electro Characteristics: (T   solder pad =25 ℃)   

Emitting Area Size

(mm)

WLP

(nm)

Radiation Intensity

(W/cm2)

Forward Voltage (V)

Power (W)

Typ.@1500mA

33.96*28.3

390~395

≥15

140

180


Applications

Industrial curing

UV exposure

Printing

Plate printing


Reference

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