LP-UVM5535180A1 UVA curing module uses high-power UVA thin film vertical chips to provide the most efficient and flexible light source for curing. It has flexible PCB circuit design and high reliability gold-wire bonding. This module can achieve high density UV light output in small luminous area and the size and power of the product can be customized according to customer requirements.
Ceramic plate with high thermal conductivity
Vertical chips with high center energy density
Special chip wire bond design improves reliability
Electro Characteristics： (T solder pad =25 ℃)
Emitting Area Size
Forward Voltage (V)