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Flip Chip LED screen

HP 18W/5050

HP employs ceremic plate to achieve high coefficient of thermal conductivity,and special eutectic process gives lower thermal resistence and better heat performance, Weld pad with hermoelectric separation design makes it can be driven by huge current; and special  optical lens gives lambert curve emission that is easy for secondary light distribution.

Product features

Ceramic substrate package,High brightness,High efficiency

Size: 5.0mmx5.0mmx3.0mm

According to the ANSI standard colour gamut

Compatible with SMT

Viewing Angle: 120°

Package: Max 700pcs/reel


Product Showcase

Electro Characteristics : ( T solder pad =85℃,IF=700mA@12V )

Normal CCT

Typ.Ra 

Flux Rank / min Flux (lm)

J4K2K4M2
1120120012901380
6500K70




Applications

Street lighting  

Tunnel lighting   

Portable lighting

Industrial and mining lighting

Reference

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