The LED uses our GaN-on-Si UVA chips and 3535 high-power ceramic packaging process,with wavelength range of 370nm/385nm/395nm/405nm.
3535 ceramic packaging is compatible with many different type of standard PCB board
UVA LED has high irradiance and optical power output
Primary optical lens emission design with 120° light angle
Excellent reliability, high performance at low cost
High-power ceramics package, high radiant energy
Si-UV LED chip
Size: 3.5mmx3.5mmx2.3mm
8KV electrostatic protection
Solder method: SMT
Electro Characteristics: (T solder pad =25 ℃,IF=500mA) | ||||||
Product | Peakwavelength (nm) | Total Rad Flux (mW) | Voltage (V) | Directivity 2θ1/2 (degree) | Current (mA) | |
Typ. | Max. | |||||
UXEO-G | 405 (400-405) | 800-1100 | 3.45 | 3.8 | 120° | 500 |
395 (390-400) | 800-1100 | 3.45 | 3.8 | 120° | 500 | |
385 (380-390) | 800-1100 | 3.45 | 3.8 | 120° | 500 | |
370 (365-375) | 600-900 | 3.6 | 4 | 120° | 500 |