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GaN-on-Si LED Chips

LatticePower's high-power LED chip based on technology which won the first prize of 2015 National Technical Innovation award. This chip features uniform distribution of current, single-side light emitting, high quality light, perfect for mobile lighting such as automotive light, searchlight and miner lamp, as well as flashlight of mobile phones and other lighting applications that require uniform and precision color.


Product

Size

(mil)

Current

(mA)

Main Wavelength

(nm)

LPTBG32B 32x32 350~500445~465
LPTBG36A 36x36 350~700445~465
LPTBG45A45x45 350~1000445~465
LPTBG56D56x56 350~1500445~465
LPTBG81B81x81350~2000445~465


applications

Portable lighting

Mobile flash

Automotive lighting

Special purpose lighting

Indoor and outdoor lighting

Features and benefits

● Reflecting Silver contact provide uniform current distribition and allow for high drive current
● The silicon substrate has better heat dissipation than sapphire substrate
● Lambert luminous pattern with uniform white
● Less wire bonding, high reliability
● Works with conductive silver adhesive, soldering tin or eutectic bonded LED die

● The vertical LED chip works with direct phosphor coating for cost reduction and higher quality light

● Suitable for high power ceramic package

Flip Chips

LatticePower's flip chip shares many design features of our vertical chip. It has high long-term reliability, excellent ESD properties, high efficiency, high drive current, Low Vf, Our flipchip is an industry leader in terms of high performance and low cost. It has been used in automotive lighting, mobile flash light, outdoor lighting, inddor commercial lighting.


Product

Size

 (mil)

Current 

(mA)

Main Wavelength 

(nm)  

LPQBE28F28x28350~500445~465
LPQBE36A36X36350~700445~465
LPQBE46D46x46 350~1000445~465 
LPQBE57C57x57 350~1500445~465 
LPQBE80D80x80350~2000445~465


applications

Automotive lighting

Flashlight of mobile phones      

Indoor and outdoor lighting

Features and benefits

● Ag reflector contact enable low voltage and uniform current density to ensure high performance and reliability
● No wire-bond packaging and high reliability
●  Best suited for high-power ceramic packaging
● Good for CSP products