Adopting high-end multi junction chip technology and existing ultra high power chip packaging technology from Jingneng, we can customize VCSEL series products with different structural shapes, bands, power, FOV, etc. for customers. Applied in the market of facial recognition, AR/VR, intelligent assisted driving, floor sweepers, drones and other applications, 3D images are brought closer to various aspects of life and provide a more accurate, intelligent, and secure era for this.