On the afternoon of June 10th 2017, the Aladdin Forum - Technology Summit: The Development and Marketization of Light Source Device Technology was successfully held in the South Hall of Conference Room 8 in Exhibition Area B of Guangya Exhibition. Liang Fubo, Vice President of Jingneng Optoelectronics, delivered a keynote speech on the development of high-power light source packaging, sharing the characteristics and market applications of CSP technology, one of the "Four Beauties" of LED packaging in Jingneng Optoelectronics.

Development and Classification of LED Packaging Technology

LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. In general, the cores of discrete devices are sealed within the packaging body, and the main function of the packaging is to protect the cores and complete electrical interconnection. LED packaging, on the other hand, is the function of outputting electrical signals, protecting the normal operation of the tube core, and outputting visible light. It has both electrical and optical parameters and technical requirements, making it impossible to simply use packaging of discrete devices for LEDs.

Introduction to Chip Level Packaging (CSP) Technology

CSP LED=(<1.2X) flip chip size+chip level packaging process

CSP LED requires a breakthrough in flip chip architecture, and the luminous angle can meet customer requirements through structural design.

From single chip high-power LED packaging to multi chip LED high-power packaging, Crystal Energy Optoelectronics has made a significant contribution throughout the entire development process.

NICHIA predicts that all high-power packaging products of 1W and above will have the opportunity to be replaced by CSP in the future.

Characteristics of Crystal Energy Optoelectronic CSP Technology:

1. Low thermal resistance;

2. Significantly improved reliability - low risk of failure after thermal expansion;

3. High brightness and single sided light output;

4. High optical density.

These are both technical difficulties and characteristics.

Crystal Energy Optoelectronic CSP products are different from general packaging forms. Due to the absence of solid crystal layer defects and the thermal resistance of the support, the thermal resistance of the entire CSP light source is less than 1k/w; The product adopts a special composite material structure design, which will reduce the risk of light source failure caused by the high expansion coefficient of the mounting substrate.

Five sided luminescent CSP, approximately 28% of the light is emitted towards the substrate direction.

The area and reflectivity of reflective ink seriously affect the luminous flux.

Single test results in high light efficiency, while multiple tests simultaneously result in high light loss.

Discussion on CSP Application Market

1. Consumer electronics: Mobile flash, TV backlight

2. Lamp: Automotive headlights (including matrix)

3. Outdoor lighting: street lights, tunnel lights, and floodlights

4. High density COB, adjustable color temperature module group

After the speech, the forum guests answered everyone's questions one by one, mainly focusing on the development and research directions of light source devices in the future market.

Mr. Tang Guoqing, Director of the Semiconductor Lighting Committee of the China Lighting Electrical Appliances Association, has a premonition that CSP will become a top priority in the future market. We acknowledge and appreciate the ability of Crystal Energy Optoelectronics to form its own industrial chain model from epitaxy to chips and packaging. Including the conversion of UV LED technology into products and its widespread application in the market, such as nail curing and industrial curing, bringing tangible beauty enjoyment to people's daily life needs.